Xilinx公司的Spartan-3E系列FPGA有五个品种,容量从10万到160万系统门,采用先进的90nm工艺技术,具有MicroBlaze 和PicoBlaze嵌入处理器核,支持高达333Mbps的DDR SDRAM,特别适合大批量对成本敏感的消费类电子产品应用.本文介绍了Spartan-3E系列FPGA的主要特性, 架构图以及采用Spartan-3E的汽车电子ECU 开发套件XA3S1600E的主要特性,开发板方框图以及开发板详细电路图.
The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from
100,000 to 1.6 million system gates.
The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of configuration.
These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously
possible, setting new standards in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.
The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
Spartan-3E 主要特性:
Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO™ interface pins
-Up to 376 I/O pins or 156 differential signal pairs
-LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
-3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
-622+ Mb/s data transfer rate per I/O
-True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
-Enhanced Double Data Rate (DDR) support
-DDR SDRAM support up to 333 Mb/s
Abundant, flexible logic resources
-Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
-Efficient wide multiplexers, wide logic
-Fast look-ahead carry logic
-Enhanced 18 x 18 multipliers with optional pipeline
-IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM™ memory architecture
-Up to 648 Kbits of fast block RAM
-Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
-Clock skew elimination (delay locked loop)
-frequency synthesis, multiplication, division
-High-resolution phase shifting
-Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
-Low-cost, space-saving SPI serial Flash PROM
-x8 or x8/x16 parallel NOR Flash PROM
-Low-cost Xilinx Platform Flash with JTAG
Complete Xilinx ISE® and WebPACK™ software
MicroBlaze and PicoBlazeembedded processor cores
Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
Low-cost QFP and BGA packaging options
-Common footprints support easy density migration
-Pb-free packaging options
XA Automotive version available
Table 1: Spartan®-3E系列
图1.Spartan®-3E系列架构图
Spartan-3E 汽车电子ECU 开发套件XA3S1600E
The Xilinx Automotive Electronic Control Unit (ECU) Development Kit is a platform for rapid development of gateway systems, infotainment, driver assistance and driver information systems.
The Xilinx Automotive FPGA Devices Advantage
The Xilinx Automotive (XA) product family is developed specifically for automotive applications. This family is ideal for a wide range of advanced automotive electronics modules and systems ranging from the latest Driver Assistance and Infotainment systems to Hybrid/Reconfigurable Instrument Clusters and In-Vehicle Networks. These applications benefit from the flexibility, reconfigurability and advanced on-chip resources, such as multipliers for high speed DSP, provided in devices from the Xilinx automotive industry’s leading PLD supplier. Xilinx XA devices include:
Extended temperature ranges, both Automotive I-Grade and Q-Grade
Full PPAP documentation support
Industry-recognized AEC-Q100 device qualification
Xilinx is committed to quality and is certified to the automotive quality standard ISO TS16949, as well as Pb-free packaging to meet the RoHS directive.
Versatile XA3S1600E Board designed for rapid development
The XA3S1600E Development Board is equipped with a Spartan-3E 1.6 million system gate FPGA, and has on-board hardware interfaces such as CAN 2.0C, Ethernet 10/100, USB 2.0, SPI, and SCI. Soft core IPs from Xilinx and 3rd party partners provide the interfaces for building MOST systems, FlexRay connectivity, CAN bus interfaces, as well as a host of automotive applications IP.
Complete Out-of-the Box Development System
Xilinx Development Kits are a complete development environment that lets you experience the flexibility of the Xilinx FPGAs. The XA Automotive ECU Development Kit includes:
XA1600E development board with the XC3S1600EFG484 device
Power supply with universal adaptor
Programming cable
Custom serial cable
QuickStart Guide
EDK and ISE Evaluation Tools
Resource CD
XA3S1600E 主要特性:
Xilinx device: XC3S1600EFG484 FPGA
Complete out-of-the box development system
On-board hardware interfaces such as CAN 2.0C, Ethernet 10/100, USB 2.0, SPI, and SCI
Support for pre-verified Xilinx and Partner IP for High and Low Speed CAN, FlexRay™ and MOST® network interfaces.
Daughter card is required for MOST interface.
XA3S1600E 目标应用:
Automotive subsystems
In-vehicle networking systems
Infotainment
Driver assistance and information systems
图2.XA3S1600E方框图
图3. XA3S1600E开发套件外形图
图4. XA3S1600E开发板电路图(1)
图5. XA3S1600E开发板电路图(2)
图6. XA3S1600E开发板电路图(3)
图7. XA3S1600E开发板电路图(4)
图8. XA3S1600E开发板电路图(5)
图9. XA3S1600E开发板电路图(6)
图10. XA3S1600E开发板电路图(7)
图11. XA3S1600E开发板电路图(8)
详情请见:
http://www.xilinx.com/products/devkits/HW-XA3S1600E-UNI-G.htm
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